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Thermal degradation of insulation materials from the cable industry
Kučera, Filip ; Krbal, Michal (referee) ; Pelikán, Luděk (advisor)
The aim of this bachelor thesis is to get acquainted with the properties and parameters of insulation materials of various types (PVC, PE). Measure these properties with a Tettex 2830/2831. Perform a theoretical analysis of the aging of insulating materials and propose a procedure for the formation of thermal degradation. Finally, find out how the properties of insulating materials, electrical strength and mechanical properties change due to thermal degradation.
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Thermal aging of lead-free low-temperature joints
Jansa, Vojtěch ; Šandera, Josef (referee) ; Adámek, Martin (advisor)
The aim of this masterś thesis is to investigate properties of lead-free low-temperature solders after termal aging. The theoretical part is focused on various types of lead - free solders, pastes used for the manufacture of electrical circuits by thick-film technology and methods of testing the properties of the soldered joints. The practical part deals with the design and production of test substrates for testing the solder joints formed between the SMD component and the ceramic substrate. Two solder bismuth-containing solder was selected for testing, the SAC solder was selected as the reference. After aging with temperature cycling from -30 ° C to 115 ° C, the data obtained by testing the mechanical strength of the solder joint by the shear test is evaluated.
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Thermal degradation of insulation materials from the cable industry
Kučera, Filip ; Krbal, Michal (referee) ; Pelikán, Luděk (advisor)
The aim of this bachelor thesis is to get acquainted with the properties and parameters of insulation materials of various types (PVC, PE). Measure these properties with a Tettex 2830/2831. Perform a theoretical analysis of the aging of insulating materials and propose a procedure for the formation of thermal degradation. Finally, find out how the properties of insulating materials, electrical strength and mechanical properties change due to thermal degradation.
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Thermal aging of lead-free low-temperature joints
Jansa, Vojtěch ; Šandera, Josef (referee) ; Adámek, Martin (advisor)
The aim of this masterś thesis is to investigate properties of lead-free low-temperature solders after termal aging. The theoretical part is focused on various types of lead - free solders, pastes used for the manufacture of electrical circuits by thick-film technology and methods of testing the properties of the soldered joints. The practical part deals with the design and production of test substrates for testing the solder joints formed between the SMD component and the ceramic substrate. Two solder bismuth-containing solder was selected for testing, the SAC solder was selected as the reference. After aging with temperature cycling from -30 ° C to 115 ° C, the data obtained by testing the mechanical strength of the solder joint by the shear test is evaluated.
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